NEW Bergquist Gap Pad EMI 1.0 available from Quist Electronics!
Gap Pad® EMI 1.0
Thermally Conductive, Conformable EMI Absorbing Material
Features and BenefitsFeatures and Benefits
• Thermal Conductivity: 1.0 W/m-K
• Electromagnetic Interference (EMI) absorbing
• Highly conformable, low hardness
• Fiberglass reinforced for puncture, shear
and tear resistance
• Electrically isolating
Gap Pad® EMI 1.0 is a highly conformable,
combination gap filling material offering both
thermal conductivity performance and
Electromagnetic Energy absorption (cavity
resonances and/or cross-talk causing
Electromagnetic Interference) at frequencies
of 1GHz and higher.
The material offers EMI suppression and
1.0 W/m-K thermal conductivity performance
with low assembly stress. The soft nature of
the material enhances wet-out at the
interface resulting in better thermal
performance than harder materials with a
similar performance rating.
Gap Pad® EMI 1.0 has an inherent, natural tack
on one side of the material eliminating the
need for thermally-impeding adhesive layers
and allowing improved handling during
placement and assembly. The other side is
tack-free, again enhancing handling and rework,
if required. Gap Pad® EMI 1.0 is supplied with a
protective liner on the material’s tacky side.