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ALL FLEX (Flexible Printed Circuits)
ASI  (Adhesive Systems Inc)
BERGQUIST COMPANY
CARLING TECHNOLOGIES
DELTA PRODUCTS CORPORATION
FEDERAL MOGUL CORPORATION
FEMA ELECTRONICS CORPORATION
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MECHANICAL PRODUCTS INC
MOMENTIVE PERFORMANCE MATERIALS
OTTO ENGINEERING INC
QUABBIN WIRE & CABLE CO
RICHCO INC
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SunLED CORPORATION
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WILBRECHT LEDCO, INC.
BERGQUIST COMPANY

BERGQUIST COMPANY

http://www.bergquistcompany.com/


Bergquist supplies the world with some of the best-known brands in the business: Sil-Pad thermally conductive interface materials, Gap Pad electrically insulating and non-insulating gap fillers, Hi-Flow phase change grease replacement materials, Bond-Ply thermally conductive adhesive tapes, and Thermal Clad insulated metal substrates.

Sil Pad Thermally Conductive Insulators

Sil Pad 400
  • Thermal impedance: 1.13°C-in2/W (@50 psi)
  • Original Sil-Pad material
  • Excellent mechanical and physical characteristics
  • Flame retardant 

 

Data Sheet

Sil Pad 800
  • Thermal impedance: 0.45°C-in2/W (@50 psi)
  • High value material
  • Smooth and highly compliant surface
  • Electrically isolating

 

Data Sheet

Sil Pad 900S
  • Thermal impedance: 0.61ºC-in2/W (@50 psi)
  • Low mounting pressures
  • Smooth and highly compliant surface
  • Electrically isolating
  • General-purpose thermal interface material solution

 

Data Sheet

Sil Pad 980
  • Thermal impedance: 1.07°C-in2/W (@50 psi)
  • Excellent cut-through resistance
  • Use in screw mounted applications with cut-through problems

 

Data Sheet

 
Sil Pad 1100ST 
  • Inherent tack on both sides for exceptional thermal performance and easy placement
  • Re-positionable for higher utilization, ease of use and assembly error reduction
  • Lined on both sides for ease of handling prior to placement in high volume assemblies
  • Exhibits exceptional thermal performance even at a low mounting pressure
  • Fiberglass reinforced

 

Data Sheet

 
Sil Pad 1200
  • Thermal impedance: 0.53°C-in2/W (@50 psi)
  • Exceptional thermal performance at lower application pressures
  • Smooth and non-tacky on both sides for easy re-positioning, ease of use and assembly error reduction 
  • Superior breakdown voltage and surface "wet out" values
  • Designed for applications where electrical isolation is critical
  • Excellent cut-thru resistance, designed for screw and clip mounted applications

 

Data Sheet

Sil Pad A1500
  • Thermal impedance: 0.42°C-in2/W (@50 psi)
  • Elastomeric compound coated on both sides

 

 Data Sheet

Sil Pad 1500 ST
  • Thermal impedance: 0.23°C-in²/W (@50 psi)
  • Inherent surface tack on both sides
  • Pad is re-positionable
  • Excellent thermal performance
  • Auto-placement and dispensable

 

Data Sheet

Sil Pad 1750
  • Thermal impedance: 0.53°C-in2/W (@50 psi)
  • Excellent dielectric strength retention after humidity exposure
  • Elastomeric pad

 

Data Sheet

 Sil Pad 2000
  • Thermal impedance 0.33°C-in2/W (@50 psi)
  • Complies with military standards
  • Optimal heat transfer
  •  High thermal conductivity 3.5 W/m-K

 

Data Sheet

 
Sil Pad K-4
  • Thermal impedance:  0.48°C-in2/W (@50 psi)
  • Withstands high voltages
  • High dielectric strength
  • Very durable

 

 Data Sheet

Sil Pad K-10
  • Thermal impedance:  0.41°C-in2/W (@50 psi)
  • Tough dielectric barrier against cut-through
  • High performance film
  • Designed to replace ceramic insulators
 

Data Sheet

Sil Pad Q-Pad II  
  • Thermal impedance:  0.22°C-in2/W (@50 psi)
  • Maximum heat transfer
  • Aluminum foil coated both sides
  • Designed to replace thermal grease
 

Data Sheet

Sil Pad Q-Pad 3
 
  • Thermal impedance:  0.35°C-in2/W (@50 psi)
  • Eliminates processing constraints typically associated with grease
  • Conforms to surface textures
  • Easy handling 
  • May be installed prior to soldering and cleaning without worry
 

Data Sheet

Sil Pad Poly Pad 1000
 
  • Thermal impedance:  0.82°C-in2/W (@50 psi)
  • Polyester based
  • For applications requiring non-silicone conformal coatings
  • Designed for silicone sensitive applications requiring high performance
 

Data Sheet

Sil Pad Tube
 
  • Thermal conductivity:  SPT 400 – 0.9 W/m-K
  • Thermal conductivity:  SPT 1000 – 1.2 W/m-K
  • For clip mounted plastic power packages
 

Data Sheet

Sil Pad Shield
  
  • Bonded laminate
  • Electrically isolating
  • Copper shield between layers of Sil-Pad
  • Pre-Tinned solder point for easy grounding
 

 Data Sheet

Gap Pad Thermally Conductive Gap Filling Materials

 Gap Pad VO
  • Thermal conductivity: 0.8 W/m-K
  • Enhanced puncture, shear, and tear resistance
  • Easy material handling
  • Electrically isolating

 

 Data Sheet

 

 
 Gap Pad VO Soft
  • Thermal conductivity: 0.8 W/m-K
  • Conformable, low hardness
  • Enhanced puncture, shear and tear resistance 
  • Electrically isolating

 

 Data Sheet

 
 Gap Pad VO Ultra Soft
  • Thermal conductivity: 1.0 W/m-K
  • Highly conformable, low hardness
  • "Gel-like" modulus 
  • Designed for low-stress applications
  • Puncture, shear and tear resistant

 

Data Sheet

 
 Gap Pad 1000 SF
  • Thermal conductivity: 0.9 W/m-K
  • No silicone outgassing
  • No silicone extraction
  • Reduced tack on one side to aid in application assembly

 

 Data Sheet

 
 Gap Pad 2200 SF
  • Thermal conductivity: 2.0 W/m-K
  • Silicone-free formulation
  • Medium compliance with easy handling
  • Electrically isolating

 

Data Sheet

Gap Pad HC 1000
  • Thermal conductivity: 1.0 W/m-K
  • Highly conformable, low hardness
  • “Gel-Like” modulus
  • Fiberglass reinforced for puncture, shear and tear resistance

 

 Data Sheet

Gap Pad 1500
  • Thermal conductivity: 1.5 W/m-K
  • Unreinforced construction for additional compliancy
  • Conformable, low hardness
  • Electrically isolating

 

Data Sheet

 

Gap Pad 1500R
  • Thermal conductivity: 1.5 W/m-K
  • Fiberglass reinforced for puncture, shear and tear resistance
  • Easy release construction 
  • Electrically isolating

 

Data Sheet

Gap Pad 1500 S30
  • Thermal conductivity: 1.3 W/m-K
  • Highly conformable, "super soft", low hardness
  • Decreased strain on fragile components
  • Fiberglass reinforced for puncture, shear and tear resistance
  • Quick rebound to original shape
 

 

Data Sheet

 
Gap Pad A2000
  • Thermal conductivity: 2.0 W/m-K
  • Fiberglass reinforced for puncture, shear and tear resistance
  • Electrically isolating 
 

 

Data Sheet

Gap Pad 2000 S40
  • Thermal conductivity: 2.0 W/mK
  • Low "S-Class" thermal resistance at very low pressures
  • Highly conformable, low hardness
  • Designed for low stress applications
  • Fiberglass reinforced for puncture, shear and tear resistance
 

 

Data Sheet

 
Gap Pad 2500 S20
• Thermal conductivity = 2.4 W/mK
• Low S-Class thermal resistance at ultra low pressures
• Ultra conformable “gel-like” modulus
• Designed for low stress applications
• Fiberglass reinforced for puncture, shear and tear resistance

 
 

 

Data Sheet

 
Gap Pad 2500
  • Thermal conductivity: 2.7 W/m-K
  • High thermal performance, cost-effective solution
  • Unreinforced construction for additional compliancy
  • Medium compliancy and conformability
 

 

Data Sheet

Gap Pad A3000
  • Thermal conductivity: 3.0 W/m-K
  • Fiberglass reinforced for puncture, shear and tear resistance
  • Reduced tack on one side to aid in application assembly
  • Electrically isolating
 

 

Data Sheet

Gap Pad 3000 S30
  • Thermal conductivity: 3.0 W/m-k
  • Low "S-Class" thermal resistance at very low pressures
  • Highly conformable, "S-Class" softness
  • Designed for low-stress applications
  • Fiberglass reinforced for puncture, shear, and tear resistance
 

 

Data Sheet

 
Gap Pad 5000 S35
  • High thermal conductivity: 5 W/m-K Highly conformable,
    "S-Class" softness
  • Natural inherent tack reduces interfacial thermal resistance
  • Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile component leads
  • Fiberglass reinforced for puncture, shear and tear resistance
  • Excellent thermal performance at low pressures
 

 

Data Sheet

 
Gap Filler 1000
  • Thermal conductivity: 1.0 W/m-K
  • Ultra-conforming, designed for fragile and low-stress applications
  • Ambient and accelerated cure schedules
  • 100% Solids – no cure by-products
  • Excellent low and high temperature mechanical and chemical stability
 

 

Data Sheet

Gap Filler 2000
  • Thermal conductivity: 1.0 W/m-K
  • Ultra-conforming, designed for fragile and low-stress applications
  • Ambient and accelerated cure schedules
  • 100% Solids – no cure by-products
  • Excellent low and high temperature mechanical and chemical stability

 

Data Sheet

Gap Filler 1500
Gap Filler 1500 is a two-part, high performance, thermally conductive liquid gap filling material, which features superior slump resistance and high shear thinning characteristics for optimized consistency and control during dispensing. 

 

Data Sheet

Gap Filler 3500 S35
  • Thermal conductivity: 3.6 W/m-K
  • Thixotropic nature makes it easy to dispense
  • Two part formulation for easy storage
  • Ultra-conforming -- designed for fragile and low-stress applications
  • Ambient or accelerated cure schedules

 

Data Sheet

Thermally Conductive Adhesives

Bond-Ply 100
  • Thermal impedance:  0.86°C-in2/W (@100 psi)
  • High bond strength to a variety of surfaces
  • Double-sided, pressure sensitive adhesive tape
  • High performance, thermally conductive acrylic adhesive
  • Can be used instead of heat cure adhesive, screw mounting or clip mounting.
 

Data Sheet

Bond-Ply 400
  • Thermal performance:  5.4 °C/W (1)
  • Easy Application
  • Eliminates need for external hardware (screws, clips, etc.)
  • Available with easy release tabs

 

Data Sheet

 

Bond-Ply 450
  • Thermal performance:  0.87°C-in2/W (@50 psi)
  • Pre-applied and exclusively available on Bergquist T-Clad
  • Eliminates future adhesive assembly requirements
  • Withstands reflow processing

 

Data Sheet

 

Bond-Ply 660
  • Designed to replace mechanical fasteners or screws
  • For applications that require electrical isolation
  • Double sided pressure sensitive adhesive tape


Data Sheet

 

Liqui-Bond SA 1000
  • High thermal performance
  • Eliminates need for mechanical fasteners
  • Low viscosity for ease of screening or stenciling
  • Can achieve a very thin bond line
  • Mechanical and chemical stability
  • Maintains structural bond in severe-environment applications
  • Heat cure

 

Data Sheet

 

Liqui-Bond SA 1800
  • High thermal conductivity: 1.8W/m-K
  • Eliminates need for mechanical fasteners
  • Low viscosity for ease of screening or stenciling
  • Maintains structural bond in severe-environment applications
  • Heat cure

 

Data Sheet

 

Liqui-Bond SA 2000
  • High thermal conductivity: 2.0 W/m-k
  • Eliminates need for mechanical fasteners
  • One-part formulation for easy dispensing
  • Mechanical and chemical stability
  • Maintains structural bond in severe-environment applications
  • Heat cure

 

Data Sheet

 


LEDs - Standard Configurations

Bergquist offers a family of standard thermally conductive insulated metal substrate (IMS) circuit boards specifically for LED applications. Now you can get a jump-start on your design with one of these star or square substrates; available in single, strip or array configurations.

Bergquist Thermal Clad® - Standard Power LED IMS Selection Guide
LED Footprint Type Star Board (1-up)
(A) Part No.
Star Array(36-up) (B) Part No. Square Board (1-up) (C) Part No. Square Strip (17-up) (D) Part No.
1 Osram Golden Dragon® 803128 803268 803118 803288
2 Osram Ostar SMT 803808 803809 803807 803810
3 Osram Oslon 804087 804561 804559 804563
4 Lite-On® LOPL 803123 803263 803113 803283
5 Lumex SML-LX 803124 803264 803114 803284
6 Lumileds™ Luxeon® I, III and V 803125 803265 803115 803285
7 Lumileds™ Luxeon® K2 803126 803266 803116 803286
8 Lumileds™ Luxeon® Rebel 803127 803267 803117 803287
9 Cree® XLamp® XR-E 803122 803262 803112 803282
10 Cree® XLamp® XP-E 804090 804091 804089 804092
11 Cree® XLamp® XP-G 804511 - - -
12 Cree® XLamp® MX-6 804450 - - -
13 Cree® XLamp® MC-E 803772 803790 803771 803806
14 Seoul Semiconductor Z-Power P4 803129 803269 803119 803289
15 Seoul Semiconductor Z-Power P5 803774 803803 803773 803804
16 Seoul Semiconductor Z-Power P7 - - 803482 803805
17 Nichia Power LED 6.5 x 5.0 803291 803292 803290 803293
18 Nichia Rigel 3.5 x 3.5 804155 804562 804560 804564
19 Samsung Sunnix 804068 804069 804067 804070
20 Avago Moonstone™ Emitter 803121 803261 803111 803281



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